AME
AME8822
n
Recommended Operating Conditions
Parameter
Ambient Temperature Range
Junction Temperature Range
Storage Temperature Range
High PSRR, 250mA CMOS LDO
Symbol
T
A
T
J
T
STG
Rating
- 40 to +85
- 40 to +125
- 65 to +150
Unit
o
o
o
C
C
C
n
Thermal Information
Parameter
Package
SOT-23
Thermal Resistance
(Junction to Ambient)
SOT-25
TSOT-25A
Conductive Epoxy
SC-70-5
DFN-4A
SOT-23*
Thermal Resistance
(Junction to Case)
SOT-25*
TSOT-25A*
SC-70-5*
N/A
DFN-4A
SOT-23
SOT-25
Internal Power Dissiption
TSOT-25A
Conductive Epoxy
SC-70-5
DFN-4A
Maximum Junction Temperature
Lead Temperature (Soldering 10 Sec)**
300
N/A
150
260
o
o
Die Attach
Non-Conductive
Epoxy
Symbol
Maximum
280
Unit
θ
JA
260
230
331
100
o
Non-Conductive
Epoxy
C/W
140
θ
JC
Conductive Epoxy
81
81
Non-Conductive
Epoxy
P
D
400
400
455
mW
C
C
* Measure
θ
JC
on backside center of molding compund if IC has no tab.
** MIL-STD-202G 210F
Rev.F.04
7
AME [ ANALOG MICROELECTRONICS ]
