AME
AME8822
n Recommended Operating Conditions
High PSRR, 250mA CMOS LDO
Parameter
Symbol
Rating
- 40 to +85
- 40 to +125
- 65 to +150
Unit
oC
oC
oC
Ambient Temperature Range
Junction Temperature Range
Storage Temperature Range
TA
TJ
TSTG
n Thermal Information
Parameter
Package
Die Attach
Symbol
Maximum
Unit
Non-Conductive
Epoxy
SOT-23
280
SOT-25
TSOT-25A
SC-70-5
DFN-4A
260
230
331
100
Thermal Resistance
(Junction to Ambient)
qJA
Conductive Epoxy
oC / W
Non-Conductive
Epoxy
SOT-23*
140
SOT-25*
TSOT-25A*
SC-70-5*
DFN-4A
81
81
Thermal Resistance
(Junction to Case)
qJC
Conductive Epoxy
N/A
400
Non-Conductive
Epoxy
SOT-23
SOT-25
TSOT-25A
SC-70-5
DFN-4A
400
455
300
N/A
150
PD
Internal Power Dissiption
mW
Conductive Epoxy
oC
oC
Maximum Junction Temperature
Lead Temperature (Soldering 10 Sec)**
260
* Measure qJC on backside center of molding compund if IC has no tab.
** MIL-STD-202G 210F
Rev.F.04
7
AME [ ANALOG MICROELECTRONICS ]
