AME
AME8500
mProcessor Supervisory
n Thermal Information
Parameter
Package
Die Attach
Symbol
Maximum
Unit
Conductive Epoxy
81
SOT-23
TSOT-23**
Non-Conductive
Epoxy
140
Thermal Resistance
(Junction to Case)
SOT-25
TSOT-25**
Non-Conductive
Epoxy
oC / W
qJC
140
40
Conductive Epoxy
SOT-89*
Non-Conductive
Epoxy
46
Conductive Epoxy
260
280
SOT-23
TSOT-23
Non-Conductive
Epoxy
Thermal Resistance
(Junction to Ambient)
SOT-25
TSOT-25
Non-Conductive
Epoxy
oC / W
qJA
280
180
180
400
400
Conductive Epoxy
SOT-89
Non-Conductive
Epoxy
Conductive Epoxy
SOT-23
TSOT-23
Non-Conductive
Epoxy
SOT-25
TSOT-25
Non-Conductive
Epoxy
Internal Power Dissipation
PD
mW
400
550
550
Conductive Epoxy
SOT-89
Non-Conductive
Epoxy
oC
oC
Maximum Junction Temperature
Solder Iron (10 Sec)***
150
350
* Measure qJC on backside center of tab.
** Measure qJC on center of molding compound if IC has no tab.
*** MIL-STD-202G 210F
Rev.T.10
21
AME [ ANALOG MICROELECTRONICS ]
