AME, Inc.
AME5170
n
Absolute Maximum Ratings
Parameter
Input Supply Voltage
EN, FB Voltages
SW Voltage
N-Channel Switch Sink Current
ESD Classification
Low Cost Micro Power
Boost DC/DC Converter
Symbol
V
IN
EN,V
FB
V
SW
I
SW
Maximum
6
V
IN
V
OUT
+ 0.3
600
B*
Unit
V
V
V
mA
Caution: Stress above the listed absolute rating may cause permanent damage to the device.
* HBM B: 2000~3999V
n
Recommented Operating Conditions
Parameter
Ambient Temperature Range
Junction Temperature Range
Storage Temperature Range
Symbol
T
A
T
J
T
STG
Rating
- 40 to 85
- 40 to 125
- 65 to 150
Unit
O
C
n
Thermal Information
Parameter
Thermal Resistance*
(Junction to Case)
Thermal Resistance
(Junction to Ambient)
Internal Power Dissipation
Solder Iron (10Sec)**
SOT-25
TSOT-25
Conductive Epoxy
Package
Die Attach
Symbol
θ
J
C
θ
JA
P
D
Maximum
81
Unit
o
C/W
260
400
350
mW
o
C
* Measure
θ
JC
on backside center of molding compund if IC has no tab.
** MIL-STD-202G 210F
Rev.A.02
5
AME [ ANALOG MICROELECTRONICS ]
