AME
AME41-1.2
Shunt Bandgap Voltage Reference
n Thermal Information
Parameter
Package
Die Attach
Symbol
Maximum
Unit
SOT-23
140
Non-Conductive
Epoxy
Thermal Resistance*
(Junction to Case)
TO-92-2
TO-92-3
oC / W
qJC
80
60
Conductive
Epoxy
SOP-8
SOT-23
280
150
150
400
625
810
Non-Conductive
Epoxy
Thermal Resistance
(Junction to Ambient)
TO-92-2
TO-92-3
oC / W
qJA
Conductive
Epoxy
SOP-8
SOT-23
Non-Conductive
Epoxy
TO-92-2
TO-92-3
Internal Power Dissipation
PD
mW
Conductive
Epoxy
SOP-8
oC
oC
Maximum Junction Temperature
Solder Iron (10 Sec)**
150
350
* Measure qJC on center of molding compound if IC has no tab.
** MIL-STD-202G 210F
n Electrical Specifications
Unless otherwise specified, TA = 250C, I=100µA
Test Condition
Parameter
Reference Voltage, ±0.5%
Minimum Current
Symbol
VREF
Min
Typ
Max
Units
V
TA = 25oC, IREF = 100µA
1.244 1.250 1.256
30
IMIN
µA
IMIN < I < 1mA
1.5
4
3
8
Reference Voltage Change
With Current
dVREF/I
mV
1mA < I < 20mA
Reference Voltage Temp.
Coeff.
0oC < TA < 70oC
ppm/oC
VREFTC
100
6
Rev.G.03
AME [ ANALOG MICROELECTRONICS ]
