AME
AME385-2.5
n
Thermal Information
Parameter
Package
SOT-23
Thermal Resistance*
(Junction to Case)
TO-92-2
TO-92-3
SOP-8
SOT-23
Thermal Resistance
(Junction to Ambient)
TO-92-2
TO-92-3
SOP-8
SOT-23
Shunt Bandgap Voltage Reference
Die Attach
Non-Conductive
Epoxy
Conductive
Epoxy
Non-Conductive
Epoxy
Conductive
Epoxy
Symbol
Maximum
140
Unit
θ
JC
80
60
280
o
C/W
θ
JA
150
150
400
625
810
150
350
o
C/W
Internal Power Dissipation
Non-Conductive
Epoxy
TO-92-2
P
D
http://tw.club.yahoo.com/clubs/Tsao
TO-92-3
SOP-8
Conductive
Epoxy
mW
Maximum Junction Temperature
Solder Iron (10 Sec)**
o
C
C
o
* Measure
θ
JC
on center of molding compound if IC has no tab.
O
** MIL-STD-202G 210F
F
6
Rev.G.03
AME [ ANALOG MICROELECTRONICS ]
