AME
AME385-1.2
Shunt Bandgap Voltage Reference
n Thermal Information
Parameter
Package
Die Attach
Symbol
Maximum
Unit
SOT-23
140
Non-Conductive
Epoxy
Thermal Resistance*
(Junction to Case)
TO-92-2
TO-92-3
oC / W
qJC
80
60
Conductive
Epoxy
SOP-8
SOT-23
280
150
150
400
625
810
Non-Conductive
Epoxy
Thermal Resistance
(Junction to Ambient)
TO-92-2
TO-92-3
oC / W
qJA
Conductive
Epoxy
SOP-8
SOT-23
Non-Conductive
Epoxy
TO-92-2
TO-92-3
Internal Power Dissipation
PD
mW
Conductive
Epoxy
SOP-8
oC
oC
Maximum Junction Temperature
Solder Iron (10 Sec)**
150
350
* Measure qJC on center of molding compound if IC has no tab.
** MIL-STD-202G 210F
6
Rev.G.03
AME [ ANALOG MICROELECTRONICS ]
