AME, Inc.
AME1300
300mA CMOS LDO with RESET Function
n
Package Dimension
MSOP-8
SYMBOLS
A
A
1
A2
u
MILLIMETERS
MIN
-
0.05
0.81
0.28
0.03
0.14
0.14
2.90
4.78
2.90
INCHES
MIN
-
0.002
0.03
0.011
0.011
0.0055
0.006
0.114
0.188
0.114
MAX
1.07
0.20
0.91
0.38
0.33
0.23
0.17
3.10
4.98
3.10
MAX
0.042
0.006
0.036
0.015
0.013
0.009
0.0065
0.12
0.196
0.122
b
b1
c
c1
D
E
E1
e
e1
L
L1
L2
0.65 TYP
1.95 TYP
0.406
0.686
0.0255 TYP
0.0767 TYP
0.016
0.027
0.94 REF
0.254 TYP
0
o
8
o
0.037 REF
0.010 TYP
0
o
8
o
è
NOTE:
1. Controlling dimension : Millimeter, converted inchdimension
are not necessarily exact.
2. Dimensiioning and tolerancing per ansi Y14.5m-1994.
3. Dimension "d" does not include mold flash,protrusion or gate
burr, mold flash,protrusion and gate burr shall not exceed
0.15mm(0.006") per side. Dimension e1 do not include inter-lead
flash or protrusion, inter-lead flash and protrusion shall not
exceed 0.15mm(0.006") per side.
4. The package top be smaller than the package bottom. Dimen-
sion d and e1 are determined at outermost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate burrs
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
5. Dimension 'b' does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm(0.0031) total in excess of
the "b" dimension at maximum material condition.
9
AME [ ANALOG MICROELECTRONICS ]
