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AM29LV800DT-70EC 参数 Datasheet PDF下载

AM29LV800DT-70EC图片预览
型号: AM29LV800DT-70EC
PDF下载: 下载PDF文件 查看货源
内容描述: 8兆位( 1一M× 8位/ 512的K× 16位) CMOS 3.0伏只引导扇区闪存 [8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory]
分类和应用: 闪存内存集成电路光电二极管
文件页数/大小: 51 页 / 1726 K
品牌: AMD [ AMD ]
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P R E L I M I N A R Y  
Global  
Revision Summary  
Converted datasheet to Preliminary.  
Revision A (January 19, 2004)  
Ordering Information  
Changed data sheet status to Advance Informa-  
tion to indicate new 0.23 µm process tech-  
nology. The base device part number has  
changed from Am29LV800B to Am29LV800D.  
Specifications for ICC1, tWHWH1, tWHWH2 have  
changed. Extended temperature is no longer  
available. All other specifications in the data  
sheet remain unchanged. Deleted references to  
KGD option in Connection Diagrams section.  
(This document was formerly released as publi-  
cation 21490, revision H.)  
Added Pb-Free packages and updated Valid  
Combinations tables to include changes.  
Absolute Maximum Rating  
Changed ambient with power applied from  
125°C to 85°C.  
Revision A+3 (June 23, 2004)  
Global change  
Changed all Helvetica/Times Roman fonts to Gill  
Sans For AMD or Verdana.  
Revision A+1 (February 3, 2004)  
“Physical Dimensions” on page 47  
Distinctive Characteristics, General Description,  
Ordering Information  
Added VBK048 Package Drawing.  
“Ordering Information” on page 8  
Deleted references to KGD option. (This docu-  
ment was formerly released as publication  
21490, revision H1.)  
Added “WC =...to Standard Products table.  
Added “WCC, WCI, WCD, WCF” to Valid combi-  
nations table.  
Revision A+2 (April 2, 2004)  
General Description  
Added Colophon.  
Removed unlock bypass section.  
Revision A+4 (January 21, 2005)  
Added migration statement.  
Colophon  
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-  
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-  
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the  
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,  
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for  
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that FASL will not be liable to you  
and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices  
have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures  
into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating condi-  
tions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Ex-  
change and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior  
authorization by the respective government entity will be required for export of those products.  
Trademarks  
Copyright © 2000–2005 Advanced Micro Devices, Inc. All rights reserved.  
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.  
ExpressFlash is a trademark of Advanced Micro Devices, Inc.  
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.  
49  
Am29LV800D  
Am29LV800D_00_A4_E January 21, 2005  
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