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AM29DL800BT120WBC 参数 Datasheet PDF下载

AM29DL800BT120WBC图片预览
型号: AM29DL800BT120WBC
PDF下载: 下载PDF文件 查看货源
内容描述: 8兆位( 1一M× 8位/ 512的K× 16位) CMOS 3.0伏只,同时操作闪存 [8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory]
分类和应用: 闪存内存集成电路
文件页数/大小: 46 页 / 1480 K
品牌: AMD [ ADVANCED MICRO DEVICES ]
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D A T A
S H E E T
GENERAL DESCRIPTION
The Am29DL800B is an 8 Mbit, 3.0 volt-only flash
memory device, organized as 524,288 words or
1,048,576 bytes. The device is offered in 44-pin SO,
48-pin TSOP, and 48-ball FBGA packages. The word-
wide (x16) data appears on DQ0–DQ15; the byte-wide
(x8) data appears on DQ0–DQ7. This device requires
only a single 3.0 volt V
CC
supply to perform read, pro-
gram, and erase operations. A standard EPROM
programmer can also be used to program and erase
the device.
This device is manufactured using AMD’s 0.35 µm pro-
cess technology, and offers all the features and
benefits of the Am29DL800, which was manufactured
using a 0.5 µm technology.
The standard device offers access times of 70, 90, and
120 ns, allowing high-speed microprocessors to oper-
ate without wait states. Standard control pins—chip
enable (CE#), write enable (WE#), and output enable
(OE#)—control read and write operations, and avoid
bus contention issues.
The device requires only a
single 3.0 volt power sup-
ply
for both read and write functions. Internally
generated and regulated voltages are provided for the
program and erase operations.
proper cell margin. The
Unlock Bypass
mode facili-
tates faster programming times by requiring only two
write cycles to program data instead of four.
Device erasure occurs by executing the erase com-
mand sequence. This initiates the
Embedded Erase
algorithm—an internal algorithm that automatically
preprograms the array (if it is not already programmed)
before executing the erase operation. During erase, the
device automatically times the erase pulse widths and
verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by observing the RY/BY#
pin, or by reading the DQ7 (Data# Polling) and DQ6
(toggle)
status bits.
After a program or erase cycle has
been completed, the device automatically returns to
reading array data.
The
sector erase architecture
allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection
measures include a low
VCC detector that automatically inhibits write operations
during power transitions. The
hardware sector protec-
tion
feature disables both program and erase operations
in any combination of the sectors of memory. This can be
achieved in-system or via programming equipment.
The
Erase Suspend
feature enables the user to put
erase on hold for any period of time to read data from,
or program data to, any sector within that bank that is
not selected for erasure. True background erase can
thus be achieved. There is no need to suspend the
erase operation if the read data is in the other bank.
The
hardware RESET# pin
terminates any operation
in progress and resets the internal state machine to
reading array data. The RESET# pin may be tied to the
system reset circuitry. A system reset would thus also
reset the device to reading array data, enabling the sys-
tem microprocessor to read the boot-up firmware from
the Flash memory.
The device offers two power-saving features. When ad-
dresses have been stable for a specified amount of
time, the device enters the
automatic sleep mode.
The system can also place the device into the
standby
mode.
Power consumption is greatly reduced in both
these modes.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
h i g h e s t l eve l s o f q u a l i t y, r e l i a b i l i t y, a n d c o s t
effectiveness. The device electrically erases all bits
within a sector simultaneously via Fowler-Nordheim
tunneling. The bytes are programmed one byte or word
at a time using hot electron injection.
Simultaneous Read/Write Operations with
Zero Latency
The Simultaneous Read/Write architecture provides
si-
multaneous operation
by dividing the memory space
into two banks. Bank 1 contains eight boot/parameter
sectors, and Bank 2 consists of fourteen larger, code
sectors of uniform size. The device can improve overall
system performance by allowing a host system to pro-
gram or erase in one bank, then immediately and
simultaneously read from the other bank, with
zero la-
tency.
This releases the system from waiting for the
completion of program or erase operations.
Am29DL800B Features
The device offers complete compatibility with the
JEDEC single-power-supply Flash command set
standard.
Commands are written to the command reg-
ister using standard microprocessor write timings.
Register contents serve as input to an internal state
machine that controls the erase and programming cir-
cuitry. Write cycles also internally latch addresses and
data needed for the programming and erase opera-
tions. Reading data out of the device is similar to
reading from other Flash or EPROM devices.
Device programming occurs by executing the program
command sequence. This initiates the
Embedded
Program
algorithm—an internal algorithm that auto-
matically times the program pulse widths and verifies
2
Am29DL800B
21519C4 December 4, 2006