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A160CT12VF 参数 Datasheet PDF下载

A160CT12VF图片预览
型号: A160CT12VF
PDF下载: 下载PDF文件 查看货源
内容描述: 16兆位(2M ×8位/ 1的M× 16位) CMOS 1.8伏只超低电压闪存 [16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS 1.8 Volt-only Super Low Voltage Flash Memory]
分类和应用: 闪存
文件页数/大小: 52 页 / 1031 K
品牌: AMD [ AMD ]
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D A T A S H E E T  
data. Standard microprocessor read cycles that assert  
If the system asserts VHH on the pin, the device auto-  
matically enters the aforementioned Unlock Bypass  
mode and uses the higher voltage on the pin to reduce  
the time required for program operations. The system  
would use a two-cycle program command sequence as  
required by the Unlock Bypass mode. Removing VHH  
from the WP#/ACC pin returns the device to normal  
operation.  
valid addresses on the device address inputs produce  
valid data on the device data outputs. The device  
remains enabled for read access until the command  
register contents are altered.  
See “Reading Array Data” on page 21 for more infor-  
mation. Refer to the AC table for timing specifications  
and to Figure 13, on page 35 for the timing diagram.  
ICC1 in the DC Characteristics table represents the  
active current specification for reading array data.  
Program and Erase Operation Status  
During an erase or program operation, the system may  
check the status of the operation by reading the status  
bits on DQ7–DQ0. Standard read cycle timings and ICC  
read specifications apply. Refer to “Write Operation  
Status” on page 27 for more information, and to “AC  
Characteristics” on page 35 for timing diagrams.  
Writing Commands/Command Sequences  
To write a command or command sequence (which  
includes programming data to the device and erasing  
sectors of memory), the system must drive WE# and  
CE# to VIL, and OE# to VIH.  
Standby Mode  
For program operations, the BYTE# pin determines  
whether the device accepts program data in bytes or  
words. Refer to “Word/Byte Configuration” on page 9  
for more information.  
When the system is not reading or writing to the device,  
it can place the device in the standby mode. In this  
mode, current consumption is greatly reduced, and the  
outputs are placed in the high impedance state, inde-  
pendent of the OE# input.  
The device features an Unlock Bypass mode to facili-  
tate faster programming. Once the device enters the  
Unlock Bypass mode, only two write cycles are  
required to program a word or byte, instead of four. The  
“Word/Byte Program Command Sequence” on  
page 22 contains details on programming data to the  
device using both standard and Unlock Bypass  
command sequences.  
The device enters the CMOS standby mode when the  
CE# and RESET# pins are both held at VCC ± 0.2 V.  
(Note that this is a more restricted voltage range than  
VIH.) If CE# and RESET# are held at VIH, but not within  
VCC ± 0.2 V, the device is in the standby mode, but the  
standby current is greater. The device requires stan-  
dard access time (tCE) for read access when the device  
is in either of these standby modes, before it is ready to  
read data.  
An erase operation can erase one sector, multiple sec-  
tors, or the entire device. Table 2, on page 12 and  
Table 3, on page 13 indicate the address space that  
each sector occupies. A “sector address” consists of  
the address bits required to uniquely select a sector.  
The “Command Definitions” on page 21 contains  
details on erasing a sector or the entire chip, or sus-  
pending/resuming the erase operation.  
The device also enters the standby mode when the  
RESET# pin is driven low. Refer to “RESET#: Hard-  
ware Reset Pin” on page 10.  
If the device is deselected during erasure or program-  
ming, the device draws active current until the  
operation is completed.  
After the system writes the autoselect command  
sequence, the device enters the autoselect mode. The  
system can then read autoselect codes from the  
internal register (which is separate from the memory  
array) on DQ7–DQ0. Standard read cycle timings apply  
in this mode. Refer to “Autoselect Mode” on page 14  
and “Autoselect Command Sequence” on page 22 for  
more information.  
ICC3 in the DC Characteristics table represents the  
standby current specification.  
Automatic Sleep Mode  
The automatic sleep mode minimizes Flash device  
energy consumption. The device automatically enables  
this mode when addresses remain stable for tACC + 50  
ns. The automatic sleep mode is independent of the  
CE#, WE#, and OE# control signals. Standard address  
access timings provide new data when addresses are  
changed. While in sleep mode, output data is latched  
and always available to the system. ICC4 in the DC  
Characteristics table represents the automatic sleep  
mode current specification.  
ICC2 in the DC Characteristics table represents the  
active current specification for the write mode. The “AC  
Characteristics” on page 35 contains timing specifica-  
tion tables and timing diagrams for write operations.  
Accelerated Program Operation  
The device offers accelerated program operation  
through the ACC function, which is one of two functions  
provided by the WP#/ACC pin. This function is primarily  
intended to allow faster in-system programming of the  
device during the system production process.  
RESET#: Hardware Reset Pin  
The RESET# pin provides a hardware method of reset-  
ting the device to reading array data. When the  
10  
Am29SL160C  
21635C5 January 23, 2007  
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