Revision 1.26 – October 15, 2007
440EPx – PPC440EPx Embedded Processor
Preliminary Data Sheet
Table 17. Package Thermal Specifications
Thermal resistance values for the TE-PBGA package in a convection environment at 6.3W are as follows:
Airflow
ft/min
(m/sec)
Parameter
Symbol
Unit
Notes
0
100
200
300
400
500
(0)
(0.51)
(1.02)
(1.53
(2.04)
(2.55)
Junction-to-ambient thermal resistance
without heat sink
θJA
θJA
13.1
11.1
11.7
8.2
10.9
7.2
10.5
6.8
10.3
6.6
10
°C/W
°C/W
5
Junction-to-ambient thermal resistance
with heat sink
6.3
5, 6
Resistance Value
Junction-to-case thermal resistance
θJC
θJB
3.5
°C/W
°C/W
5
5
Junction-to-board thermal resistance
7.3
Notes:
1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
2. TA = TC − P×θCA, where TA is ambient temperature and P is power consumption.
3. TCMax = TJMax − P×θJC, where TJMax is maximum junction temperature (+125°C) and P is power consumption.
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved using a JEDEC standard board with the following characteristics: 114.5mm x 101.6mm x 1.6mm, 4
layers. The board has 100 thermal vias (same as the number of thermal balls on the TE-PBGA package).
6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a
0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK.
Thermal Management
The following heat sink was used in the above thermal analysis:
ALPHA LPD35-15B (35mm x 35mm x15mm)
The heat sink is manufactured by:
Alpha Novatech, Inc. (www.alphanovatech.com)
473 Sapena Court, #12
Santa Clara, CA 95054
Phone: 408-567-8082
72
AMCC Proprietary
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
