欢迎访问ic37.com |
会员登录 免费注册
发布采购

PPC440SP-ANC667C 参数 Datasheet PDF下载

PPC440SP-ANC667C图片预览
型号: PPC440SP-ANC667C
PDF下载: 下载PDF文件 查看货源
内容描述: 的PowerPC 440SP嵌入式处理器 [PowerPC 440SP Embedded Processor]
分类和应用: 微控制器和处理器外围集成电路微处理器PC时钟
文件页数/大小: 85 页 / 1264 K
品牌: AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
 浏览型号PPC440SP-ANC667C的Datasheet PDF文件第60页浏览型号PPC440SP-ANC667C的Datasheet PDF文件第61页浏览型号PPC440SP-ANC667C的Datasheet PDF文件第62页浏览型号PPC440SP-ANC667C的Datasheet PDF文件第63页浏览型号PPC440SP-ANC667C的Datasheet PDF文件第65页浏览型号PPC440SP-ANC667C的Datasheet PDF文件第66页浏览型号PPC440SP-ANC667C的Datasheet PDF文件第67页浏览型号PPC440SP-ANC667C的Datasheet PDF文件第68页  
Revision 1.23 - Sept 26, 2006  
Data Sheet  
PowerPC 440SP Embedded Processor  
Table 8. Package Thermal Specifications  
Thermal resistance values for the PPC440SP package in a convection environment are as follows:  
Airflow  
ft/min (m/sec)  
Parameter  
Symbol  
Unit  
Notes  
0 (0)  
100 (0.51)  
200 (1.02)  
Junction-to-case thermal resistance  
θJC  
θCA  
0.6  
0.6  
0.6  
°C/W  
°C/W  
1
2
Case-to-ambient thermal resistance (w/o heat sink)  
15.5  
13.1  
11.9  
Range  
Minimum  
Maximum  
Junction-to-ball (typical)  
θJB  
6.5  
6.5  
°C/W  
3
Notes:  
1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board. For this part the junction  
temperature and the case temperature are essentially identical.  
2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately  
predict thermal performance in production equipment environments. The operational case temperature must be maintained.  
3. 6.5 °C/W is the theoretical θJB using an infinite heat sink. The larger number applies to the module mounted on a 1.8mm thick,  
2P card using 1oz. copper power planes, with an effective heat transfer area of 75mm2.  
Table 9. Recommended DC Operating Conditions (Sheet 1 of 3)  
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended  
conditions can affect device reliability.  
Parameter  
Logic Supply Voltage 533 MHz  
Logic Supply Voltage 667 MHz  
I/O Supply Voltage  
Symbol  
Minimum  
+1.4  
Typical  
+1.5  
Maximum  
+1.6  
Unit  
V
Notes  
VDD  
4
4
4
VDD  
+1.425  
+3.0  
+1.5  
+1.575  
+3.6  
V
OVDD  
+3.3  
V
PCI-X I/O Supply Voltage  
PCI-X DDR  
+3.0  
+3.3  
1.5  
+3.6  
PxVDD  
V
V
V
4
4
4
1.425  
1.575  
Voltage Reference Input for PCI-X DDR mode 2  
PCIX0VRef0:1  
SVDD  
+1.425  
+1.5  
+1.575  
DDR1 SDRAM Supply Voltage  
DDR2 SDRAM  
+2.3  
1.7  
+2.5 (2.6)  
1.8  
+2.7  
1.9  
AxVDD  
APxVDD  
SVREF  
SVREF  
System PLL Supply Voltages  
PCI-X PLL Supply Voltages  
+1.4  
+1.4  
+1.5  
+1.5  
+1.6  
+1.6  
V
V
V
V
3
3
3
DDR1 SDRAM Reference Voltage  
DDR2 SDRAM Reference Voltage  
+1.15  
+1.25  
+1.35  
0.49 x SVDD  
0.50 x SVDD  
0.51 x SVDD  
64  
AMCC Proprietary