Revision 1.07 – October 4, 2007
440GP – Power PC 440GP Embedded Processor
Data Sheet
Package Thermal Specifications
Thermal resistance values for the CBGA and PBGA packages in a convection environment are as follows:
Airflow
ft/min (m/sec)
Parameter
Symbol
Package
Unit
Notes
0 (0)
<0.1
1.2
100 (0.51)
<0.1
200 (1.02)
<0.1
Ceramic
Plastic
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1
Junction-to-case thermal resistance
θJC
θCA
θJB
1.2
1.2
1, 3
2
Ceramic
Plastic
18.9
17.7
16.3
Case-to-ambient thermal resistance (w/o heat
sink)
20.8
2, 3
Ceramic
Plastic
Junction-to-ball (typical)
8.0
3
Notes:
1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately predict
thermal performance in production equipment environments. The operational case temperature must be maintained.
3. Modeled on standard JEDEC 2S2P card, 50x50mm
56
AMCC
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
