Revision 1.07 – September 10, 2007
PPC405EP – PowerPC 405EP Embedded Processor
Figure 2. 31mm, 385-Ball E-PBGA Package
Top View
Data Sheet
Logo View
Gold Gate Release
Corresponds to
A01 Ball Location
®
PPC405EP
1YWWBZZZZZ
15.5 TYP
Lot Number
Part Number
C
Notes: 1. All dimensions are in mm.
2. Package available in leaded and lead-free configurations.
C
0.20
C
0.25
0.20
A
31.0
0.35
C
Bottom View
27.98
AC
1.27 TYP
AB
Y
AA
W
U
R
N
L
Mold
Compound
V
T
Thermal Balls
P
PCB
Substrate
31.0 ± 0.2
M
K
J
H
F
G
E
D
B
C
A
B
01 03 05 07 09 11 13 15 17 19 21 23
0.6±0.1
08 10
06
12 14
16 18
04
22
20
02
2.36 REF
2.65 max
2.07 min
0.65 ± 0.05 SOLDERBALL x 385
s
s
s
B
∅ 0.30 C A
s
∅ 0.15
C
12
AMCC
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
