Device and Package Cross Reference
9
Table 8.
MAX 7000 Devices (Part 1 of 2)
Device
PLCC, Wire Bond
EPM7032B
TQFP, Wire Bond
UBGA, Wire Bond
TQFP, Wire Bond
EPM7064B
UBGA, Wire Bond
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
UBGA, Wire Bond
TQFP, Wire Bond
EPM7128B
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
UBGA, Wire Bond
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
TQFP, Wire Bond
EPM7256B
UBGA, Wire Bond
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
UBGA, Wire Bond
EPM7512B
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
BGA, Wire Bond, Option 1
EPM7032AE
PLCC, Wire Bond
TQFP, Wire Bond
PLCC, Wire Bond
UBGA, Wire Bond
EPM7064AE
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
TQFP, Wire Bond
FBGA, Wire Bond, Option 1
PLCC, Wire Bond
FBGA, Wire Bond, Option 1
EPM7128AE
TQFP, Wire Bond
TQFP, Wire Bond
UBGA, Wire Bond
FBGA, Wire Bond, Option 1
Package
Pins
44
44
49
44
49
100
100
49
100
100
144
169
256
100
144
169
208
256
144
169
208
256
256
44
44
44
49
100
44
100
256
84
100
100
144
169
256
© December 2011
Altera Corporation
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