7–10
Chapter 7: Package Information
Package Outlines
144-Pin Plastic Thin Quad Flat Pack (TQFP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994
Controlling dimension is in millimeters
Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Nom.
Symbol
Ordering Code Reference
T
Min.
Max.
Package Acronym
Leadframe Material
TQFP
A
A1
A2
D
—
—
1.60
0.15
1.45
Copper
0.05
1.35
—
1.40
Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
Lead Finish (Plating)
22.00 BSC
20.00 BSC
22.00 BSC
JEDEC Outline Reference MS-026 Variation: BFB
D1
E
Maximum Lead
0.003 inches (0.08 mm)
Coplanarity
Weight
1.1 g
E1
L
20.00 BSC
0.60
Printed on moisture barrier
bag
0.45
0.75
Moisture Sensitivity Level
L1
S
b
1.00 REF
—
0.20
0.17
0.09
—
0.22
0.27
0.20
c
—
e
0.50 BSC
3.5°
θ
0°
7°
MAX II Device Handbook
© October 2008 Altera Corporation
ALTERA [ ALTERA CORPORATION ]
