欢迎访问ic37.com |
会员登录 免费注册
发布采购

EPM1270GM100C 参数 Datasheet PDF下载

EPM1270GM100C图片预览
型号: EPM1270GM100C
PDF下载: 下载PDF文件 查看货源
内容描述: MAX II器件系列 [MAX II Device Family]
分类和应用:
文件页数/大小: 86 页 / 1216 K
品牌: ALTERA [ ALTERA CORPORATION ]
 浏览型号EPM1270GM100C的Datasheet PDF文件第48页浏览型号EPM1270GM100C的Datasheet PDF文件第49页浏览型号EPM1270GM100C的Datasheet PDF文件第50页浏览型号EPM1270GM100C的Datasheet PDF文件第51页浏览型号EPM1270GM100C的Datasheet PDF文件第53页浏览型号EPM1270GM100C的Datasheet PDF文件第54页浏览型号EPM1270GM100C的Datasheet PDF文件第55页浏览型号EPM1270GM100C的Datasheet PDF文件第56页  
4–2  
Chapter 4: Hot Socketing and Power-On Reset in MAX II Devices  
Hot Socketing Feature Implementation in MAX II Devices  
I/O Pins Remain Tri-Stated during Power-Up  
A device that does not support hot-socketing may interrupt system operation or cause  
contention by driving out before or during power-up. In a hot socketing situation, the  
MAX II device’s output buffers are turned off during system power-up. MAX II  
devices do not drive out until the device attains proper operating conditions and is  
fully configured. Refer to “Power-On Reset Circuitry” on page 4–5 for information  
about turn-on voltages.  
Signal Pins Do Not Drive the VCCIO or VCCINT Power Supplies  
MAX II devices do not have a current path from I/O pins or GCLK[3..0]pins to the  
CCIO or VCCINT pins before or during power-up. A MAX II device may be inserted into  
V
(or removed from) a system board that was powered up without damaging or  
interfering with system-board operation. When hot socketing, MAX II devices may  
have a minimal effect on the signal integrity of the backplane.  
AC and DC Specifications  
You can power up or power down the VCCIO and VCCINT pins in any sequence. During  
hot socketing, the I/O pin capacitance is less than 8 pF. MAX II devices meet the  
following hot socketing specifications:  
The hot socketing DC specification is: | IIOPIN | < 300 μA.  
The hot socketing AC specification is: | IIOPIN | < 8 mA for 10 ns or less.  
1
MAX II devices are immune to latch-up when hot socketing. If the TCKJTAG input  
pin is driven high during hot socketing, the current on that pin might exceed the  
specifications above.  
I
IOPIN is the current at any user I/O pin on the device. The AC specification applies  
when the device is being powered up or powered down. This specification takes into  
account the pin capacitance but not board trace and external loading capacitance.  
Additional capacitance for trace, connector, and loading must be taken into  
consideration separately. The peak current duration due to power-up transients is  
10 ns or less.  
The DC specification applies when all VCC supplies to the device are stable in the  
powered-up or powered-down conditions.  
Hot Socketing Feature Implementation in MAX II Devices  
The hot socketing feature turns off (tri-states) the output buffer during the power-up  
event (either VCCINT or VCCIO supplies) or power-down event. The hot-socket circuit  
generates an internal HOTSCKTsignal when either VCCINT or VCCIO is below the  
threshold voltage during power-up or power-down. The HOTSCKT signal cuts off the  
output buffer to make sure that no DC current (except for weak pull-up leaking) leaks  
through the pin. When VCC ramps up very slowly during power-up, VCC may still be  
relatively low even after the power-on reset (POR) signal is released and device  
configuration is complete.  
MAX II Device Handbook  
© October 2008 Altera Corporation