There is a slight variation to the package “form” as the mold compound extends to the edge of the
substrate; refer to Figure 1A. The F484 and F780 FBGA packages will transition to center pin gate
mold. The center pin gate mold will be implemented in both Amkor and ASE assembly sites.
Figure 1A. Comparative images of the difference in mold compound coverage
Current
New Standard
Side Gate Mold
Center Pin Gate Mold
Larger Mold Area
Smaller Mold Area
Note: The overall package dimensions will remain the same
Also, the top surface of select packages will carry additional dimples (0.1mm maximum depth)
due to differences in the mold chase design. See representative image in Figure 1B. Note, there is
no impact anticipated or changes required to customers’ pick and place equipment or processes.
Figure 1B. Representative image of additional dimples on package top surface
Product Traceability and Transition Dates
The earliest shipment of affected products is scheduled to occur in December 2012. Changed
material can be distinguished using the date code (1249 and later) and/or the suffix “E” at the end
of the date code marking; refer to Figure 2. Note that the 1249 date code marking indicates the
earliest date production material could ship from the assembly sites. Initial qualification samples
may have an earlier date code marking.
The ASE assembly location can be identified by the country of origin shown on the topside
marking, refer to Table 2.
Altera Corporation
5
01/03/2013 PCN1205
ALTERA [ ALTERA CORPORATION ]
