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EP3C16Q144C6N 参数 Datasheet PDF下载

EP3C16Q144C6N图片预览
型号: EP3C16Q144C6N
PDF下载: 下载PDF文件 查看货源
内容描述: 的Cyclone III器件手册 [Cyclone III Device Handbook]
分类和应用:
文件页数/大小: 274 页 / 7308 K
品牌: ALTERA [ ALTERA CORPORATION ]
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1–4  
Chapter 1: Cyclone III Device Family Overview  
Cyclone III Device Family Features  
Table 1–2 lists Cyclone III device family package options, I/O pins, and differential  
channel counts.  
(1), (2), (3), (4), (5)  
Table 1–2. Cyclone III Device Family Package Options, I/O pin and Differential Channel Counts  
(7)  
Family  
Package E144  
M164  
P240  
F256  
U256  
F324  
F484  
U484  
F780  
EP3C5  
EP3C10  
94, 22 106, 28  
94, 22 106, 28  
182, 68 182, 68  
182, 68 182, 68  
EP3C16  
84, 19 92, 23 160, 47 168, 55 168, 55  
346, 140 346, 140  
EP3C25  
82, 18  
148, 43 156, 54 156, 54 215, 83  
Cyclone III  
(8)  
EP3C40  
128, 26  
195, 61 331, 127 331, 127 535, 227 (6)  
EP3C55  
327, 135 327, 135  
295, 113 295, 113  
377, 163  
429, 181  
531, 233  
429, 181  
429, 181  
429, 181  
429, 181  
EP3C80  
EP3C120  
EP3CLS70  
EP3CLS100  
EP3CLS150  
EP3CLS200  
283, 106  
294, 113 294, 113  
294, 113 294, 113  
Cyclone III  
LS  
226, 87  
226, 87  
Notes to Table 1–2:  
(1) For each device package, the first number indicates the number of the I/O pin; the second number indicates the differential channel count.  
(2) For more information about device packaging specifications, refer to the Cyclone III Package and Thermal Resistance webpage.  
(3) The I/O pin numbers are the maximum I/O counts (including clock input pins) supported by the device package combination and can be affected  
by the configuration scheme selected for the device.  
(4) All packages are available in lead-free and leaded options.  
(5) Vertical migration is not supported between Cyclone III and Cyclone III LS devices.  
(6) The EP3C40 device in the F780 package supports restricted vertical migration. Maximum user I/Os are restricted to 510 I/Os if you enable  
migration to the EP3C120 and are using voltage referenced I/O standards. If you are not using voltage referenced I/O standards, you can increase  
the maximum number of I/Os.  
(7) The E144 package has an exposed pad at the bottom of the package. This exposed pad is a ground pad that must be connected to the ground  
plane on your PCB. Use this exposed pad for electrical connectivity and not for thermal purposes.  
(8) All Cyclone III device UBGA packages are supported by the Quartus II software version 7.1 SP1 and later, with the exception of the UBGA  
packages of EP3C16, which are supported by the Quartus II software version 7.2.  
Cyclone III Device Handbook  
Volume 1  
July 2012 Altera Corporation