Contents
Guidelines for IEEE Std. 1149.1 Boundary-Scan Testing ............................................................. 14–18
Boundary-Scan Description Language (BSDL) Support .............................................................. 14–19
Conclusion .......................................................................................................................................... 14–19
References ........................................................................................................................................... 14–19
Document Revision History ............................................................................................................. 14–20
Section VII. PCB Layout Guidelines
Revision History .................................................................................................................................. 14–1
Chapter 15. Package Information for Cyclone II Devices
Introduction .......................................................................................................................................... 15–1
Thermal Resistance .............................................................................................................................. 15–2
Package Outlines ................................................................................................................................. 15–4
144-Pin Plastic Thin Quad Flat Pack (TQFP) – Wirebond ........................................................ 15–4
208-Pin Plastic Quad Flat Pack (PQFP) – Wirebond ................................................................. 15–7
240-Pin Plastic Quad Flat Pack (PQFP) ....................................................................................... 15–9
256-Pin FineLine Ball-Grid Array, Option 2 – Wirebond ....................................................... 15–11
484-Pin FineLine BGA, Option 3 – Wirebond .......................................................................... 15–13
484-Pin Ultra FineLine BGA – Wirebond ................................................................................. 15–15
672-Pin FineLine BGA Package, Option 3 – Wirebond ........................................................... 15–17
896-Pin FineLine BGA Package – Wirebond ............................................................................ 15–19
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Altera Corporation
Cyclone II Device Handbook, Volume 1
ALTERA [ ALTERA CORPORATION ]
