Cyclone Device Handbook, Volume 1
Table 2–10. DQ Pin Groups (Part 2 of 2)
Number of × 8 DQ
Total DQ Pin
Count
Device
Package
Pin Groups
EP1C6
144-pin TQFP
4
4
4
4
4
8
8
8
32
32
32
32
32
64
64
64
240-pin PQFP
256-pin FineLine BGA
240-pin PQFP
EP1C12
EP1C20
256-pin FineLine BGA
324-pin FineLine BGA
324-pin FineLine BGA
400-pin FineLine BGA
Note to Table 2–10:
(1) EP1C3 devices in the 100-pin TQFP package do not have any DQ pin groups in
I/O bank 1.
A programmable delay chain on each DQS pin allows for either a 90°
phase shift (for DDR SDRAM), or a 72° phase shift (for FCRAM) which
automatically center-aligns input DQS synchronization signals within the
data window of their corresponding DQ data signals. The phase-shifted
DQS signals drive the global clock network. This global DQS signal clocks
DQ signals on internal LE registers.
These DQS delay elements combine with the PLL’s clocking and phase
shift ability to provide a complete hardware solution for interfacing to
high-speed memory.
The clock phase shift allows the PLL to clock the DQ output enable and
output paths. The designer should use the following guidelines to meet
133 MHz performance for DDR SDRAM and FCRAM interfaces:
■
■
The DQS signal must be in the middle of the DQ group it clocks
Resynchronize the incoming data to the logic array clock using
successive LE registers or FIFO buffers
■
LE registers must be placed in the LAB adjacent to the DQ I/O pin
column it is fed by
Figure 2–34 illustrates DDR SDRAM and FCRAM interfacing from the
I/O through the dedicated circuitry to the logic array.
2–48
Preliminary
Altera Corporation
January 2007