Package Information Datasheet for Mature Altera Devices
83
208-Pin Power Quad Flat Pack (RQFP)—Wire Bond
■
■
■
All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in millimeters.
Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description
Specification
R
Ordering Code Reference
Package Acronym
Leadframe Material
Lead Finish (Plating)
RQFP
Copper
Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference
Lead Coplanarity
Weight
MS-029 Variation: FA-1
0.003 inches (0.08mm)
11.0 g (Typ.) or 6.4 g (Typ.) (1)
Printed on moisture barrier bag
Moisture Sensitivity Level
Note:
(1) The lighter weight is due to the change in heat slug material used (from nickel-plated copper to anodized
aluminum). Refer to PCN1002.
Package Outline Dimension Table
Millimeters
Symbol
Min.
—
Nom.
—
Max.
4.10
0.50
3.60
A
A1
A2
D
0.25
3.20
—
3.40
30.60 BSC
28.00 BSC
30.60 BSC
28.00 BSC
0.60
D1
E
E1
L
0.45
0.75
L1
S
1.30 REF
—
0.20
0.17
0.09
—
b
—
0.27
0.20
c
—
e
0.50 BSC
3.5
0
8
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
ALTERA [ ALTERA CORPORATION ]
