Package Information Datasheet for Mature Altera Devices
75
160-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond
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All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in inches.
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description
Specification
Ordering Code Reference
Package Acronym
Leadframe Material
Lead Finish
G
PGA
Alloy 42
Gold Over Nickel Plate
MO-067 Variation: AG
N/A
JEDEC Outline Reference
Lead Coplanarity
Weight
19.9 g (Typ.)
Moisture Sensitivity Level
Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Inches
Min.
Nom.
0.190
Max.
A
A1
A2
D
0.160
0.220
0.050 TYP
0.140
0.120
1.540
1.540
0.160
1.580
1.580
1.560
E
1.560
L
0.130 TYP
0.018
b
0.016
0.020
e
0.100 BSC
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
ALTERA [ ALTERA CORPORATION ]
