Package Information Datasheet for Mature Altera Devices
49
32-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond
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All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in millimeters.
Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description
Specification
Ordering Code Reference
Package Acronym
Leadframe Material
Lead Finish (Plating)
T
TQFP
Copper
Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference
Lead Coplanarity
MS-026 Variation: ABA
0.004 inches (0.1mm)
0.2 g (Typ.)
Weight
Moisture Sensitivity Level
Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min.
Nom.
—
Max.
1.20
0.15
1.05
A
A1
A2
D
—
0.05
0.95
—
1.00
9.00 BSC
7.00 BSC
9.00 BSC
7.00 BSC
0.60
D1
E
E1
L
0.45
0.75
L1
S
1.00 REF
—
0.20
0.30
0.09
—
b
0.37
0.45
0.20
c
—
e
0.80 BSC
3.5
0
7
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
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