Package Information Datasheet for Mature Altera Devices
121
599-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond
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All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in inches.
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description
Specification
Ordering Code Reference
Package Acronym
Leadframe Material
Lead Finish
G
PGA
Alloy 42
Gold over Nickel Plate
MO-128 Variation: AP
N/A
JEDEC Outline Reference
Lead Coplanarity
Weight
69.0 g (Typ.)
Moisture Sensitivity Level
Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Inches
Min.
Nom.
—
Max.
A
A1
A2
D
—
0.205
0.050 TYP
—
—
0.145
2.475
2.475
2.445
2.445
2.460
E
2.460
L
0.130 TYP
0.018
b
0.016
0.020
e
0.100 BSC
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices