Package Information Datasheet for Mature Altera Devices
111
484-Pin FineLine Ball-Grid Array (FBGA), Option 4—Flip Chip
■
■
■
All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in millimeters.
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description
Specification
Ordering Code Reference
Package Acronym
Substrate Material
Solder Ball Composition
F
FBGA
BT
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference
Lead Coplanarity
MS-034 Variation: AAJ-1
0.008 inches (0.20 mm)
5.3 g (Typ.)
Weight
Moisture Sensitivity Level
Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min.
Nom.
—
Max.
3.50
—
A
A1
A2
A3
D
—
0.30
0.25
—
—
—
3.00
2.50
—
23.00 BSC
17.00 BSC
23.00 BSC
17.00 BSC
0.60
D1
E
E1
b
0.50
0.70
e
1.00 BSC
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices