1–12
Chapter 1: Cyclone III Device Family Overview
Reference and Ordering Information
Reference and Ordering Information
Figure 1–1 and Figure 1–2 show the ordering codes for Cyclone III and Cyclone III LS
devices.
Figure 1–1. Cyclone III Device Packaging Ordering Information
PackageType
E
Q
F
: Plastic Enhanced Quad Flat Pack (EQFP)
: Plastic Quad Flat Pack (PQFP)
OperatingTemperature
: FineLine Ball-Grid Array (FBGA)
: Ultra FineLine Ball-Grid Array (UBGA)
: Micro FineLine Ball-Grid Array (MBGA)
C
I
: Commercial temperature (TJ = 0° C to 85° C)
: Industrial temperature (TJ = -40° C to 100° C)
: Automotive temperature (TJ = -40° C to 125° C)
U
M
A
Family Signature
EP3C: Cyclone III
Optional Suffix
Indicates specific device
options or shipment method
EP3C 25
F
324
C
7
N
Package Code
Member Code
N
: Lead-free packaging
ES : Engineering sample
144 : 144 pins
164 : 164 pins
240 : 240 pins
256 : 256 pins
324 : 324 pins
484 : 484 pins
780 : 780 pins
5
: 5,136 logic elements
10 : 10,320 logic elements
16 : 15,408 logic elements
25 : 24,624 logic elements
25E : 24,624 logic elements
40 : 39,600 logic elements
55 : 55,856 logic elements
80 : 81,264 logic elements
120 : 119,088 logic elements
Speed Grade
6 (fastest)
7
8
Figure 1–2. Cyclone III LS Device Packaging Ordering Information
PackageType
OperatingTemperature
F
: FineLine Ball-Grid Array (FBGA)
: Ultra FineLine Ball-Grid Array (UBGA)
C
I
: Commercial temperature (TJ = 0° C to 85° C)
: Industrial temperature (TJ = -40° C to 100° C)
U
Family Signature
Optional Suffix
Indicates specific device
options or shipment method
EP3CLS
70
F
484
C
7
N
EP3CLS : Cyclone III LS
Package Code
Member Code
N
: Lead-free packaging
ES : Engineering sample
484 : 484 pins
780 : 780 pins
70 : 70,208 logic elements
100 : 100,448 logic elements
150 : 150,848 logic elements
200 : 198,464 logic elements
Speed Grade
7 (fastest)
8
Cyclone III Device Handbook
Volume 1
July 2012 Altera Corporation
ALTERA [ ALTERA CORPORATION ]
