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AS7C1024B-10STCN 参数 Datasheet PDF下载

AS7C1024B-10STCN图片预览
型号: AS7C1024B-10STCN
PDF下载: 下载PDF文件 查看货源
内容描述: 5V 128K X 8 CMOS SRAM [5V 128K X 8 CMOS SRAM]
分类和应用: 静态存储器
文件页数/大小: 9 页 / 112 K
品牌: ALSC [ ALLIANCE SEMICONDUCTOR CORPORATION ]
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AS7C1024B  
®
Functional description  
The AS7C1024B is a high performance CMOS 1,048,576-bit Static Random Access Memory (SRAM) device organized as 131,072 words x 8  
bits. It is designed for memory applications where fast data access, low power, and simple interfacing are desired.  
Equal address access and cycle times (tAA, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 5/6/7/8 ns are ideal for high  
performance applications. Active high and low chip enables (CE1, CE2) permit easy memory expansion with multiple-bank systems.  
When CE1 is high or CE2 is low, the devices enter standby mode. If inputs are still toggling, the device will consume ISB power. If the bus is  
static, then full standby power is reached (ISB1). For example, the AS7C1024B is guaranteed not to exceed 55 mW under nominal full standby  
conditions.  
A write cycle is accomplished by asserting write enable (WE) and both chip enables (CE1, CE2). Data on the input pins I/O0 through I/O7 is  
written on the rising edge of WE (write cycle 1) or the active-to-inactive edge of CE1 or CE2 (write cycle 2). To avoid bus contention, external  
devices should drive I/O pins only after outputs have been disabled with output enable (OE) or write enable (WE).  
A read cycle is accomplished by asserting output enable (OE) and both chip enables (CE1, CE2), with write enable (WE) high. The chips drive I/  
O pins with the data word referenced by the input address. When either chip enable is inactive, output enable is inactive, or write enable is active,  
output drivers stay in high-impedance mode.  
Absolute maximum ratings  
Parameter  
Symbol  
Min  
–0.50  
–0.50  
Max  
Unit  
V
Voltage on V relative to GND  
V
V
+7.0  
CC  
t1  
t2  
D
Voltage on any pin relative to GND  
Power dissipation  
V
+0.50  
V
CC  
P
T
1.0  
+150  
+125  
20  
W
Storage temperature (plastic)  
–65  
–55  
°C  
°C  
mA  
stg  
bias  
Ambient temperature with V applied  
T
CC  
DC current into outputs (low)  
I
OUT  
Note: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional  
operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect reliability.  
Truth table  
CE1  
CE2  
X
WE  
X
OE  
X
Data  
Mode  
Standby (I , I  
H
High Z  
High Z  
High Z  
)
)
SB SB1  
X
L
X
X
Standby (I , I  
SB SB1  
L
H
H
H
Output disable (I  
)
CC  
L
H
H
L
D
Read (I  
)
CC  
OUT  
L
H
L
X
D
Write (  
)
IN  
ICC  
Key: X = don’t care, L = low, H = high  
3/26/04, v 1.2  
Alliance Semiconductor  
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