2Gb DDR3L – AS4C128M16D3L
128M x 16 bit DDR3L Synchronous DRAM (SDRAM)
Confidential
Features
Advanced (Rev. 2.0, Aug. /2014)
Overview
JEDEC Standard Compliant
The 2Gb Double-Data-Rate-3 (DDR3L) DRAMs is
double data rate architecture to achieve high-speed
operation. It is internally configured as an eight bank
DRAM.
The 2Gb chip is organized as 16Mbit x 16 I/Os x 8
bank devices. These synchronous devices achieve high
speed double-data-rate transfer rates of up to 1600
Mb/sec/pin for general applications.
The chip is designed to comply with all key DDR3L
DRAM key features and all of the control and address
inputs are synchronized with a pair of externally
supplied differential clocks. Inputs are latched at the
cross point of differential clocks (CK rising and CK#
falling). All I/Os are synchronized with differential DQS
pair in a source synchronous fashion.
These devices operate with a single 1.35V -0.067V
/+0.1V power supply and are available in BGA
packages.
Power supplies: VDD & VDDQ = 1.35V
Backward compatible to VDD & VDDQ = 1.5V ±0.075V
Operating temperature:
- Commercial (0 ~ 95°C)
- Industrial (-40 ~ 95°C)
Supports JEDEC clock jitter specification
Fully synchronous operation
Fast clock rate: 800MHz
Differential Clock, CK & CK#
Bidirectional differential data strobe
- DQS & DQS#
8 internal banks for concurrent operation
8n-bit prefetch architecture
Internal pipeline architecture
Precharge & active power down
Programmable Mode & Extended Mode registers
Additive Latency (AL): 0, CL-1, CL-2
Programmable Burst lengths: 4, 8
Burst type: Sequential / Interleave
Output Driver Impedance Control
8192 refresh cycles / 64ms
- Average refresh period
℃ ≦
7.8μs @ -40
≦
℃
TC +85
℃ ＜
3.9μs @ +85
≦ ℃
TC +95
Write Leveling
OCD Calibration
Dynamic ODT (Rtt_Nom & Rtt_WR)
RoHS compliant
Auto Refresh and Self Refresh
96-ball 9 x 13 x 1.2mm FBGA package
- Pb and Halogen Free
Table 1. Speed Grade Information
Speed Grade
Clock Frequency
CAS Latency
tRCD
tRP
(ns)
(ns)
DDR3L-1600
800 MHz
11
13.75
13.75
Table 2. Ordering Information
Product part No Org
Temperature
Package
AS4C128M16D3L-12BCN 128M x 16
Commercial (Extended)
0°C to 95°C
Industrial
96-ball FBGA
96-ball FBGA
AS4C128M16D3L-12BIN
128M x 16
-40°C to 95°C (Extended)
Confidential
2
Rev. 2.0
Aug. /2014
ALSC [ ALLIANCE SEMICONDUCTOR CORPORATION ]
