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AS4C128M16D3A-12BIN 参数 Datasheet PDF下载

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型号: AS4C128M16D3A-12BIN
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内容描述: [AS4C128M16D3A-12BIN - 96 ball FBGA PACKAGE]
分类和应用:
文件页数/大小: 83 页 / 2180 K
品牌: ALSC [ ALLIANCE SEMICONDUCTOR CORPORATION ]
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AS4C128M16D3A-12BIN  
Table 10. Absolute Maximum DC Ratings  
Symbol  
VDD  
Parameter  
Values  
-0.4 ~ 1.8  
-0.4 ~ 1.8  
-0.4 ~ 1.8  
-55 ~ 100  
Unit Note  
Voltage on VDD pin relative to Vss  
Voltage on VDDQ pin relative to Vss  
V
V
V
V
1,3  
1,3  
1
VDDQ  
VIN, VOUT  
TSTG  
Voltage on any pin relative to Vss  
Storage temperature  
1,2  
NOTE1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the  
device.This is a stress rating only and functional operation of the device at these or any other conditions above those  
indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect reliability.  
NOTE2: Storage Temperature is the case surface temperature on the center/top side of the DRAM.  
NOTE3: VDD and VDDQ must be within 300mV of each other at all times; and Vref must be not greater than 0.6VDDQ, when  
VDD and VDDQ are less than 500mV; Vref may be equal to or less than 300mV.  
Table 11. Temperature Range  
Symbol  
Parameter  
Values  
Unit Note  
1-4  
Industrial Temperature Range  
-40 ~ 95  
C
°
TOPER  
NOTE1: Operating temperature is the case surface temperature on center/top of the DRAM.  
NOTE2: The operating temperature range is the temperature where all DRAM specification will be supported. Outside of this  
temperature range, even if it is still within the limit of stress condition, some deviation on portion of operating  
specification may be required. During operation, the DRAM case temperature must be maintained between 0-85°C  
under all other specification parameter. Supporting 0 - 85 °C with full JEDEC AC & DC specifications.  
NOTE3: Some applications require operation of the DRAM in the Extended Temperature Range between 85 °C and 95 °C  
case temperature. Full specifications are guaranteed in this range, but the following additional apply.  
a) Refresh commands must be doubled in frequency, therefore, reducing the Refresh interval tREFI to 3.9us. It is  
also possible to specify a component with 1x refresh (tREFI to 7.8us) in the Extended Temperature Range.  
b) If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to either use the  
Manual Self-Refresh mode with Extended Temperature Range capability (MR2 A6=0 and MR2 A7=1) or enable  
the optional Auto Self-Refresh mode (MR2 A6=1 and MR2 A7=0).  
NOTE4: During Industrial Temperature Operation Range, the DRAM case temperature must be maintained between  
-40°C~95°C under all operating Conditions.  
Table 12. Recommended DC Operating Conditions  
Symbol  
VDD  
Parameter  
Power supply voltage  
Power supply voltage for output  
Min.  
1.425  
1.425  
Typ.  
1.5  
Max.  
1.575  
1.575  
Unit Note  
V
V
1,2  
1,2  
VDDQ  
1.5  
NOTE1: Under all conditions VDDQ must be less than or equal to VDD.  
NOTE2: VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together.  
Confidential  
-2183-  
Rev. 1.0 May 2016  
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