Slide Switches
Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φCA（K）or CC（T）at soldering portion（copper foil surface）. A heat resisting tape
should be used for fixed measurement.
3. Temperature profile
Detector
Push
300
A max.
Slide
B
Rotary
Encoders
Power
200
C
100
Dual-in-line
Room
temperature
Time (s)
Package Type
TACT SwitchTM
Pre-heating
D max.
Custom-
Products
※
20 max.
E max.
F
A（℃）
3s max.
Series（Reflow type）
B（℃）
C（℃）
D（s）
E（s）
F（s）
Small size
General Use type
Vertical
1-pole, 3-positions
250
Big size
General Use type
Horizontal 1-pole, 2-positions
Other Use type
SSSS2 Vertical
1-pole, 2-positions
200
240
1-pole, 3-positions
2-poles, 3-positions
Horizontal
SSSS7
250
260
240
SSAH, SSAG
SSAD
230
220
150
120
1-pole, 2-positions
255
240
200
220
1-pole, 3-positions（1.5mm）
Horizontal
SSSS8
Notes
1-pole, 3-positions（2mm）
1-pole, 4-positions
2-poles, 2-positions
Vertical
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
3. ※SSAH and SSAG only 40's.
154
ALPS [ ALPS ELECTRIC CO.,LTD. ]
