Detector Switches
Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）at soldering portion（copper foil surface）. A heat resisting tape
should be used for fixed measurement.
3. Temperature profile
Detector
Push
300
Slide
A max.
B
Rotary
Encoders
Power
200
D
E
100
Dual-in-line
Package Type
Room
temperature
Time (s)
TACT SwitchTM
Pre-heating
F max.
C
Custom-
Products
A（℃）
3s max.
Series（Reflow type）
B（℃）
C（s）
D（℃）
E（℃）
F（s）
SPPB
230
40
250
SPPW8
SPVE
200
20
40
20
SPVG
S
PVL
PVM
SPVN
S
180
150
120
260
230
SPVP
SPVR
SPVS
S
SCM
Room
temperature
S
PPY5
240
150
180
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
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ALPS [ ALPS ELECTRIC CO.,LTD. ]
