Push Switches
Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape
should be used for fixed measurement.
Detector
Push
3. Temperature profile
300
A max.
Slide
B
200
Rotary
Encoders
Power
D
E
100
Room
temperature
Time (s)
Dual-in-line
Package Type
Pre-heating
F max.
TACT SwitchTM
C
Custom-
Products
A（℃）
3s max.
Series（Reflow type）
SPEE
B（℃）
C（s）
D（℃）
E（℃）
F（s）
260
230
40
180
150
120
SPEF, SPEG
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
Horizontal
Type
Vertical
Type
108
ALPS [ ALPS ELECTRIC CO.,LTD. ]
