Metal Shaft Potentiometers / Soldering Conditions
Reference for Manual Soldering
Series
Tip temperature
Soldering time
3s max.
No. of solders
1 time
350℃ max.
300℃ max.
3 5 0±10 ℃
350℃ max.
3 5 0±10 ℃
350℃ max.
300℃ max.
350℃ max.
RK09L, RK097
3s max.
1 time
1 time
1 time
1 time
1 time
1 time
1 time
RK203
RK119
RK271
RK501
RK163
+1
3 ꢀ
s
0
5s max.
+1
5 ꢀ
s
0
5s max.
3s max.
2s max.
Potentiometer
terminal
RK168
Motor terminal
Reference for Dip Soldering
Preheating
Dip soldering
Series
No. of solders
Soldering surface
Soldering
Heating time
Soldering time
temperature
temperature
100℃ max.
2 min. max.
2 min. max.
260±5℃
5±1s
2 time max.
2 time
RK09L, RK097, RK203
RK501
12 0±10 ℃
260±5℃
5±1s
Example of Reflow Soldering Condition
Temperature profile
300
200
100
A
B
C
D
Room
temperature
Time (s)
Pre-heating
E max.
F max.
G max.
H max.
Series
A
B
C
D
E
F
G
H
No. of reflows
2 time max.
260℃
230℃
180℃
150℃
2 min.
3s
40s
4 min.
RK119
Notes
1. When using an infrared reflow oven, solder may sometimes not be applied. Be sure to use a hot air reflow oven or at type that uses
infrared rays in combination with hot air.
2. The temperatures given above are the maximum temperatures at the terminals of the potentiometer when
employing a hot air reflow method. The temperature of the PC board and the surface temperature of the
potentiometer may vary greatly depending on the PC board material, its size and thickness. Ensure that the surface
temperature of the potentiometer does not rise to 250℃ or greater.
3. Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this prior to use.
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