Connector for CMOS Camera Module
Soldering Conditions
Example of Reflow Soldering Condition（Reference）
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA
（K）
CC
or
（T）at
soldering portion.
3. Temperature profile
For
SD Memory
Card
For
microSD™
Card
For
SIM Card
8pins
For
W-SIM
For
Memory
Stick Micro™
250℃(max.)
Temperature (˚C )
220℃
200
190%10℃
100
Time (s)
Pre-heating
90±30 sec.
55 sec.(max.)
Room
temperature
For
Memory
Stick™
Combine Type
For
Compact
Flash™
For PC cards
supporting
CardBus
Heating time
sec.
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or
electrical degradation to occur depending on the conditions. Caution is therefore required.
2. When soldering, do not use water soluble flux because this may corrode the product.
3. Regarding the setting of reflow conditions, please confirm them with the actual mass production conditions.
4. As PC board warping may alter characteristics, please take this into consideration when designing pattern and
layout.
For
Express
Card™
For CMOS
Camera Module
63
ALPS [ ALPS ELECTRIC CO.,LTD. ]
