Encoders Soldering Conditions
Reference for Manual Soldering
Series
Tip temperature
350℃ max.
3 5 0±10 ℃
Soldering time
No. of solders
1 time
EC05E, EC09E, EC10E, EC111, EC11B,
EC11E, EC11G, EC11K, EC12D, EC12E,
EC18A, EC21A, EC28A, EC35A, EC35AH,
EC35B, EC40A, EC45A, EC50A, EC60B,
EM11B, EM20B, EC21C
3s max.
＋1
EC11J
3
s
2 time
ꢀ0
Reference for Dip Soldering
Preheating
Dip soldering
Series
No. of solders
Soldering surfacetemperature
Heating time
Soldering temperature
Soldering time
EC09E, EC11B, EC111, EC11E, EC11G,
EC11K, EC18A, EC21A, EC28A, EC35A,
EC35AH, EC35B, EC50A, EC60B
100℃ max.
2 min. max.
260±5℃
5±1s
2 time max.
EC10E, EC12D, EC12E, EM11B
100℃ max.
110 ℃ m a x .
100℃ max.
80℃ max.
1 min. max.
1 min. max.
2 min. max.
1 min. max.
260±5℃
260℃ max.
260℃ max.
260℃ max.
3±1s
2 time max.
1 time
EC40A
EC45A
EM20B
10s max.
5s max.
2 time max.
2 time max.
3s max.
Example of Reflow Soldering Condition
Temperature profile
300
200
100
A
B
C
D
Room
temperature
Time (s)
Pre-heating
E max.
F max.
G max.
H max.
Series
No. of reflows
2 time max.
2 time max.
1 time max.
A
B
C
D
E
F
G
H
EC11J
260℃
230℃
180℃
180℃
200℃
150℃ 2 min. max.
150℃ 60s to 120s
150℃ 60s to 120s
3s
ー
40s
4 min. max.
ー
EC05E
EC21C
250℃ min. 230℃ min.
220℃
30s to 40s
25s to 60s
230℃ to 245℃
ー
300 max.
注記
1. When using an infrared reflow oven, solder may sometimes not be applied. Be sure to use a hot air reflow oven or a
ꢀ type that uses infrared rays in combination with hot air.
2. The temperatures given above are the maximum temperatures at the terminals of the encoder when
employing a hot air reflow method. The temperature of the PC board and the surface temperature of the
ꢀ encoder may vary greatly depending on the PC board material, its size and thickness. Ensure that the surface
ꢀ temperature of the encoder does not rise to 250℃ or greater.
3. Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this
ꢀ prior to use.
307
ALPS [ ALPS ELECTRIC CO.,LTD. ]
