Audio Amplification Transistor
2SC6011
PACKAGE OUTLINE DRAWING, TO-3P
15.6 ±0.3
14.0 ±0.3
13.6 ±0.2
5.0 MAX
2.1 MAX
9.6 ±0.3
Branding
XXXXXXXX
XXXXXXXX
+0.2
–0.3
1.7
+0.2
–0.1
2
(2×)
(3×)
+0.2
–0.1
3
+0.2
–0.1
0.6
+0.2
–0.1
1.0
2×P5.45 ±0.1
Terminal dimension at lead tips
15.8 ±0.2
Pin Assignments:
1. Base
2. Collector
3. Emitter
1
2
3
Terminal core material: Cu
Terminal treatment: Ni plating and solder dip
Heat sink core material: Cu
Branding codes (exact appearance at manufacturer discretion):
1st line, type: C6011
Heat sink treatment: Ni plating
Leadform number: 100
2nd line, lot:
YM
H
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
H is the hFE rating (O, P, or Y; for values see
footnote, Electrical Characteristics table)
Dimensions in millimeters
Leadframe plating Pb-free. Device composition
includes high-temperature solder (Pb >85%),
which is exempted from the RoHS directive.
Allegro MicroSystems, Inc.
5
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
ALLEGRO [ ALLEGRO MICROSYSTEMS ]
