AT1605
High-Side Power Switch IC
Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Large Body
Pkg. thickness
≥2.5mm or Pkg.
volume ≥350mm3
Small Body
Large Body
Pkg. thickness
≥2.5mm or Pkg.
Small Body
Pkg. thickness
Pkg. thickness
<2.5mm or Pkg.
volume <350mm3
≥2.5mm or Pkg.
volume ≥350mm3 volume ≥350mm3
3°C/second max.
Average ramp-up rate
3°C/second max.
(T to T )
L
P
Preheat
-Temperature Min(Tsmin)
-Temperature Max (Tsmax)
-Time (min to max)(ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
3°C/second max.
Tsmax to T
L
-Ramp-up Rate
Time maintained above:
-Temperature (T )
-Time (t )
L
183°C
60-150 seconds
217°C
60-150 seconds
L
Peak Temperature(T )
225+0/-5°C
10-30 seconds
240+0/-5°C
10-30 seconds
245+0/-5°C
10-30 seconds
250+0/-5°C
20-40 seconds
P
Time within 5°C of actual Peak
Temperature (t )
P
Ramp-down Rate
6°C/second max.
6 minutes max.
3°C/second max.
8 minutes max.
Time
25°C
to
Peak
Temperature
*All temperatures refer to topside of the package, measured on the package body surface.
7F, No.9, PARK AVENUE II, Science-Based Industrial Park, Hsinchu 300, Taiwan, R.O.C.
Tel: 886-3-563-0878
4/26/2006 REV:1.1
Fax: 886-3-563-0879
WWW: http://www.aimtron.com.tw
Email: service@aimtron.com.tw
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AIMTRON [ AIMTRON TECHNOLOGY ]
