AIC1731
Where TJ-TA is the temperature difference
between the die junction and the surrounding air,
RθJB is the thermal resistance of the package,
and RθBA is the thermal resistance through the
PCB, copper traces, and other materials to the
surrounding air.
mounting pad should provide maximum thermal
conductivity to maintain low device temperature.
GND pin performs a dual function of providing
an electrical connection to ground and
channeling heat away. Therefore, connecting
the GND pin to ground with a large pad or
ground plane would increase the power
dissipation and reduce the device temperature
As a general rule, the lower temperature is, the
better reliability of the device is. So the PCB
ꢀPHYSICAL DIMENSIONS
ꢁ SOT-23-5 (unit: mm)
SYMBOL
MIN
0.95
0.05
0.90
0.30
0.08
2.80
2.60
1.50
MAX
1.45
0.15
1.30
0.50
0.22
3.00
3.00
1.70
D
A
A1
A2
b
c
D
E
E1
e
e1
L
0.25
E
E1
c
L
θ
L1
A1
e
e1
A2
A
0.95 BSC
1.90 BSC
b
0.30
0.60
L1
θ
0.60 REF
0°
8°
Note:
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circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties
that may result from its use. We reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or
systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose
failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury to the user.
10
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