of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (TMAX) should not
exceed 235°C.
human body and on test equip-
ment) can discharge without
detection and may result in
degradation in performance,
reliability, or failure.
Application Notes
AN-S001: Basic MODAMP MMIC
Circuit Techniques
AN-S002: MODAMP MMIC
Nomenclature
AN-S003: Biasing MODAMP
MMICs
These parameters are typical for a Electronic devices may be sub-
surface mount assembly process
for the MSA-2743. As a general
guideline, the circuit board and
components should be exposed
jected to ESD damage in any of
the following areas:
• Storage & handling
• Inspection & testing
AN-S011: Using Silicon MMIC Gain
Blocks as Transimpedance
Amplifiers
only to the minimum temperatures • Assembly
AN-S012: MagIC Low Noise
Amplifiers
and times necessary to achieve a
uniform reflow of solder.
• In-circuit use
The MSA-2743 is a ESD Class 1
device. Therefore, proper ESD
precautions are recommended
when handling, inspecting, testing,
assembling, and using these
devices to avoid damage.
Electrostatic Sensitivity
RFICs are electrostatic
discharge (ESD) sensi-
tive devices. Although
the MSA-2743 is robust in design,
permanent damage may occur to
these devices if they are subjected References
to high energy electrostatic
Performance data for MSA series
discharges. Electrostatic charges
as high as several thousand volts
(which readily accumulate on the
of amplifiers are found in the
CD ROM Catalog or http://
www.agilent.com/view/rf
250
200
TMAX
150
Reflow
Zone
100
Preheat
Zone
Cool Down
Zone
50
0
0
60
120
180
240
300
TIME (seconds)
Figure 12. Surface Mount Assembly Profile.
14
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
