Absolute Maximum Ratings
[1]
Parameter
Device Current
Power Dissipation
[2,3]
RF Input Power
Junction
Temperature
Storage Temperature
Thermal
Resistance:
θ
jc
MSA-
2011
50 mA
250 mW
[3a]
+13 dBm
150°C
-65 to 150°C
500°C/W
MSA-
2035
60 mA
325 mW
[3b]
+13 dBm
200°C
-65 to 200°C
155°C/W
MSA-
2085, -2086
60 mA
325 mW
[3c]
+13 dBm
150°C
-65 to 150°C
115°C/W
Typical Biasing
Configuration
R
bias
V
CC
≥
7 V
4
DC BLOCK
INPUT
1
MSA
2
3
RF CHOKE
V
d
= 5 V
OUTPUT
R
bias
= V
CC
– V
d
I
d
Notes:
1. Permanent damage may occur if any of these limits are exceeded.
2. T
CASE
= 25°C.
3a. Derate at 2.0 mW/°C for T
C
> 25°C.
b. Derate at 6.5 mW/°C for T
C
> 149°C.
c. Derate at 8.7 mW/°C for T
C
> 112°C.
Electrical Specifications, T
A
= 25
°
C
I
D
= 32 mA, Z
o
= 50
Ω
MSA-2011
Symbol
G
P
Parameters and
Test Conditions
Power Gain
2
(|S
21
| )
f = 0.1 GHz
f = 0.5 GHz
f = 1.0 GHz
Gain Flatness
f = 0.1 to 0.6 GHz
3 dB Bandwidth
Input VSWR
f = 0.1 to 3.0 GHz
Output VSWR
f = 0.1 to 3.0 GHz
P
1dB
Power Output @
1 dB Gain
Compression:
f = 1.0 GHz
50
Ω
Noise Figure
f = 1.0 GHz
Third Order
Intercept
Point
f = 1.0 GHz
Group Delay
f = 1.0 GHz
Device Voltage
T
C
= 25°C
Device Voltage
Temperature
Coefficient
Units
Min.
Typ.
Max.
Min.
MSA-2035
Typ.
Max.
MSA-2085, -2086
Min.
Typ.
Max.
dB
15.0
dB
GHz
18.9
18.1
16.2
±
0.6
1.0
1.3:1
1.4:1
17.8
19.2
18.7
17.3
±
0.4
1.1
1.3:1
1.4:1
19.8
15.0
±
1.0
19.2
18.3
16.6
±
0.6
1.1
1.2:1
1.5:1
∆G
P
f
3dB
VSWR
dBm
dB
9.0
4.3
9.5
3.7
9.0
3.7
NF
IP
3
dBm
psec
V
mV/°C
4.0
22
143
5.0
-9.3
6.0
4.5
22
143
5.0
-9.3
5.5
4.3
22
143
5.0
-9.3
6.3
t
d
V
D
dV/dT
Note:
1. Refer to “Tape and Reel Packaging for Surface Mount Devices.”
6-471
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
