8
please refer to Agilent application
note AN-A006.
These parameters are typical for
a surface mount assembly
process for the INA-32063. As a
general guideline, the circuit
board and components should
only be exposed to the minimum
temperatures and times neces-
sary to achieve a uniform reflow
of solder.
Electrostatic Sensitivity
RFICs are electrostatic
discharge (ESD)
sensitive devices.
Although the
INA-32063 is robust in design,
permanent damage may occur to
these devices if they are sub-
jected to high-energy electrostatic
discharges. Electrostatic charges
as high as several thousand volts
(which readily accumulate on the
human body and on test equip-
ment) can discharge without
detection and may result in
degradation in performance or
failure. Electronic devices may be
subjected to ESD damage in any
of the following areas:
• Storage & handling
• Inspection & testing
• Assembly
• In-circuit use
The INA-32063 is an ESD Class 1
device. Therefore, proper ESD
precautions are recommended
when handling, inspecting, and
assembling these devices to avoid
damage.
For more information on
Electrostatic Discharge and
Control refer to Agilent
application note AN-A004R.
250
T
MAX
200
TEMPERATURE (°C)
150
Reflow
Zone
100
Preheat
Zone
50
0
0
60
120
180
240
300
TIME (seconds)
Cool Down
Zone
Figure 18. Surface Mount Assembly Profile.
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
