Package Dimensions
Outline SOT-323 ( SC-70)
1.30 (0.051)
REF.
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
0.650 BSC (0.025)
0.425 (0.017)
TYP.
2.20 (0.087)
1.80 (0.071)
0.10 (0.004)
0.00 (0.00)
0.30 REF.
0.20 (0.008)
0.10 (0.004)
1.00 (0.039)
0.80 (0.031)
0.25 (0.010)
0.15 (0.006)
10°
0.30 (0.012)
0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Package Characteristics
Lead Material ........................................................................................ Copper
Lead Finish .............................................................................Tin-Lead 85/15%
Maximum Soldering Temperature ............................... 260°C for 5 seconds
Minimum Lead Strength ........................................................... 2 pounds pull
Typical Package Inductance ................................................................... 2 nH
Typical Package Capacitance .............................. 0.08 pF (opposite leads)
Ordering Information
Specify part number followed by option. For example:
HSMP- 38XA – XXX
www.hp.com/go/rf
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Bulk or Tape and Reel Option
Part Number
Americas/Canada: 1-800-235-0312 or
408-654-8675
Surface Mount PIN
Hewlett-Packard
Far East/Australasia: Call your local HP
sales office.
Option – BLK = Bulk, 100 pcs. per antistatic bag
Japan: (81 3) 3335-8152
Option – TR1 = Tape and Reel, 3000 devices per 7" reel
Europe: Call your local HP sales office.
Conforms to Electronic Industries RS-481, “Taping of Surface Mounted
Components for Automated Placement.” Standard Quantity is
3,000 Devices per Reel.
Data subject to change.
Copyright © 1998 Hewlett-Packard Co.
Obsoletes 5966-2323E
Printed in U.S.A.
5967-6070E (5/98)
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
