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HSMP-381E-TR1 参数 Datasheet PDF下载

HSMP-381E-TR1图片预览
型号: HSMP-381E-TR1
PDF下载: 下载PDF文件 查看货源
内容描述: 表面贴装PIN二极管SOT- 323 ( SC - 70 3引脚) [Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead)]
分类和应用: 二极管
文件页数/大小: 12 页 / 91 K
品牌: AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
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10  
SMT Assembly  
passes through one or more  
Assembly Information  
SOT-323 PCB Footprint  
Reliable assembly of surface  
mount components is a complex  
process that involves many  
material, process, and equipment  
factors, including: method of  
heating (e.g., IR or vapor phase  
reflow, wave soldering, etc.)  
circuit board material, conductor  
thickness and pattern, type of  
solder alloy, and the thermal  
conductivity and thermal mass of  
components. Components with a  
low mass, such as the SOT-323  
package, will reach solder reflow  
temperatures faster than those  
with a greater mass.  
preheat zones. The preheat zones  
increase the temperature of the  
board and components to prevent  
thermal shock and begin evaporat-  
ing solvents from the solder paste.  
The reflow zone briefly elevates  
the temperature sufficiently to  
produce a reflow of the solder.  
A recommended PCB pad layout  
for the miniature SOT-323 (SC-70)  
package is shown in Figure 27  
(dimensions are in inches). This  
layout provides ample allowance  
for package placement by auto-  
mated assembly equipment  
without adding parasitics that  
could impair performance.  
The rates of change of tempera-  
ture for the ramp-up and cool-  
down zones are chosen to be low  
enough to not cause deformation  
of the board or damage to compo-  
nents due to thermal shock. The  
maximum temperature in the  
0.026  
0.07  
reflow zone (T  
exceed 235 °C.  
) should not  
MAX  
0.035  
HPs SOT-323 diodes have been  
qualified to the time-temperature  
profile shown in Figure 28. This  
profile is representative of an IR  
reflow type of surface mount  
assembly process.  
These parameters are typical for a  
surface mount assembly process  
for HP SOT-323 diodes. As a  
general guideline, the circuit  
board and components should be  
exposed only to the minimum  
temperatures and times necessary  
to achieve a uniform reflow of  
solder.  
0.016  
Figure 27. PCB Pad Layout  
( dimensions in inches) .  
After ramping up from room  
temperature, the circuit board  
with components attached to it  
(held in place with solder paste)  
250  
200  
TMAX  
150  
Reflow  
Zone  
100  
Preheat  
Zone  
Cool Down  
Zone  
50  
0
0
60  
120  
180  
240  
300  
TIME (seconds)  
Figure 28. Surface Mount Assembly Profile.