10
100
90
RELATIVE INTENSITY – %
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 7. Relative Intensity vs. Angle for HSMx-C177 and C197.
1.00
0.90
RELATIVE INTENSITY – %
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 8. Relative Intensity vs. Angle for HSMx-C150, C170, C190, C191 and C265.
10 to 20 SEC.
217 °C
TEMPERATURE
255 °C (+5/-0)
3 °C/SEC. MAX.
100 - 150 °C
6 °C/SEC. MAX.
10 SEC. MAX.
TEMPERATURE
230°C MAX.
140-160°C
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
4°C/SEC. MAX.
3°C/SEC. MAX.
MAX. 120 SEC.
60 to 150 SEC.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 9. Recommended Reflow Soldering Profile.
Figure 10. Recommended Pb-Free Reflow Soldering Profile.
0.8 (0.031)
1.5 (0.059)
1.2 (0.047)
1.2
(0.047)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
1.2
(0.047)
0.9
(0.035)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 11. Recommended Soldering
Pattern for HSMx-C150.
Figure 12. Recommended Soldering
Pattern for HSMx-C170 and C177.
Figure 13. Recommended Soldering
Pattern for HSMx-C190, C191 and C197.
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
