I/O Pin Configuration Table
Pin
1
2
3
4
5
6
7
8
–
Symbol
CX
SD
AGND
GND
RXD
V
CC
TXD
LED A
Shield
I/O
I
I
I
I
O
I
I
I
–
Description
Pin bypass capacitor
Shutdown. Active high
Analog ground
Ground
Receiver data output. Active low
Supply voltage
Transmitter data input. Active high
LED anode
EMI shield
Note
1
2
2
3
4
5
6
7
Notes:
1. Complete shutdown TXD, RXD, and PIN diode.
2. Connect to system ground.
3. Output is active low pulse response when light pulse is seen.
4. Regulated, 2.7 to 3.6 volt.
5. Logic high turns on the LED. If held high longer than
∼50 µs,
the LED is turned off
automatically. TXD must be driven either high or low. DO NOT leave the pin floating.
6. Tied through external resistor, R1, to regulate V
CC
from 2.7 to 3.6 volt.
7. Connect to system ground via a low inductance trace. For best performance, do not connect
to GND directly at the part.
Recommended Application Circuit Components
Component
Recommended Value
R1
30
Ω, ±
1%, 0.125 Watt
R1
5.6
Ω, ±
1%, 0.125 Watt
C1
6.8
µF, ±
20%, Tantalum
C2
100 nF,
±
20%, X7R Ceramic
Note
8
9
10
Marking Information
The unit is marked with the
letters "A" and the datacode
"YWW" on the shield for front
options where Y is the last digit
of the year, and WW is the
workweek.
Notes:
8. To obtain I
LED
of 50 mA for V
LED
of 3 V.
9. To obtain I
LED
of 250 mA for V
LED
of 3 V.
10. C1 must be placed within 0.7 cm of the HSDL-3203 to obtain optimum noise immunity.
Transceiver I/O Truth Table
Inputs
TXD
Light Input to Receiver
High
Don't Care
Low
High
Low
Low
Don't Care
Don't Care
SD
Low
Low
Low
High
Outputs
LED
On
Off
Off
Off
RXD
Not Valid
Low
High
High
Note
11, 12
Notes:
11. In-band IrDA signals and data rates
≤
115.2 kbit/s.
12. RXD logic low is a pulsed response. The condition is maintained for a duration independent of pattern and strength of the incident intensity.
Caution:
The BiCMOS inherent to the design of this component increases the component's susceptibility
to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in
handling and assembly of this component to prevent damage and/or degradation, which may be
induced by ESD.
3
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
