1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure ad-
equate printed solder paste vol-
ume and no shorting. See the
table below the drawing for com-
binations of metal stencil aper-
ture and metal stencil thickness
that should be used.
Aperture opening for shield pad
is 2.7 mm x 1.25 mm as per land
pattern.
Stencil Thickness, t (mm)
0.152 mm
0.127 mm
APERTURES AS PER
LAND DIMENSIONS
t
w
l
Figure 16. Solder stencil aperture.
Aperture Size (mm)
Length, l
2.60
±
0.05
3.00
±
0.05
Width, w
0.55
±
0.05
0.55
±
0.05
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space
occupied by
the unit relative to the land pat-
tern. There should be no other
SMD components within this
area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm.
It is recommended that
two fiducial crosses be placed at
mid-length of the pads for unit
alignment.
Note:
Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
8.2
0.2
2.6
SOLDER MASK
3.0
UNITS: mm
Figure 17. Adjacent land keep-out and solder mask areas.
12
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
