plane be provided in the circuit
board directly under the
transceiver to provide a low
inductance ground for signal
return current. This recommen-
dation is in keeping with good
high frequency board layout
practices.
Board Layout - Hole Pattern
The Hewlett-Packard transceiver
complies with the circuit board
“Common Transceiver Footprint”
hole pattern defined in the
original multisource announce-
ment for the 1x9 pin package
style. This drawing is reproduced
in Figure 7 with the addition of
ANSI Y14.5M compliant dimen-
sioning to be used as a guide in
the mechanical layout of your
circuit board.
Board Layout – Art Work
The Applications Engineering
group has developed Gerber file
art work for a multilayer printed
circuit board layout incorporating
the recommendations above.
Contact your local Hewlett-
Packard sales representative for
details.
Regulatory Compliance
These transceiver products are
intended to enable system
designers to develop equipment
that complies with the various
international regulations govern-
ing certification of Information
Technology Equipment. See the
Regulatory Compliance Table for
details.
Electromagnetic Interference
(EMI)
Most equipment designs utilizing
these high-speed transceivers
from Hewlett-Packard will need
to meet the requirements of the
FCC in the United States,
CENELEC EN55022 (CISPR 22)
in Europe and VCCI in Japan.
The HFBR-5301 and HFBR-5302
are suitable for use in designs
ranging from a single transceiver
in a desktop computer to large
quantities of transceivers in a
hub, switch or concentrator.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
(2X) ø 1.9 ± 0.1
.075 ± .004
Ø0.000
M
A
The first case is during handling
of the transceiver prior to mount-
ing it on the circuit board. You
should use normal ESD handling
precautions for ESD sensitive
devices. These precautions
include using grounded wrist
straps, work benches, and floor
mats in ESD controlled areas.
The second case to consider is
static discharges to the exterior
of the equipment chassis contain-
ing the transceiver parts. To the
extent that the transceiver duplex
SC connector is exposed to the
outside of the equipment chassis,
it may be subject to whatever
ESD system level test criteria that
the equipment is intended to
meet.
Immunity
Equipment utilizing these trans-
ceivers will be subject to radio-
frequency electromagnetic fields
in some environments. These
transceivers have a high immunity
to such fields (see AN1075,
“Testing and Measuring Electro-
magnetic Compatibility Perfor-
mance of the HFBR-510X/520X
Fiber-Optic Transceivers,” 5963-
3358E).
Transceiver Reliability and
Performance Qualification
Data
The 1x9 transceivers have passed
Hewlett-Packard reliability and
performance qualification testing
and are undergoing ongoing
quality monitoring. Details are
available from your Hewlett-
Packard sales representative.
These transceivers are manu-
factured at the Hewlett-Packard
Singapore location which is an
ISO 9002 certified facility.
20.32
.800
–A–
20.32
.800
(9X) ø 0.8 ± 0.1
.032 ± .004
Ø0.000
M
A
(8X) 2.54
.100
TOP VIEW
Figure 7. Recommended Board Layout Hole Pattern.
219
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
