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HFBR-2416T 参数 Datasheet PDF下载

HFBR-2416T图片预览
型号: HFBR-2416T
PDF下载: 下载PDF文件 查看货源
内容描述: 组件旨在提供高性价比,高性能光纤通信链路 [Components is Designed to Provide cost effective, High performance fiber optic communication links]
分类和应用: 光纤通信
文件页数/大小: 26 页 / 283 K
品牌: AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
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Electrical/Optical Specifications
-40 °C to +85 °C unless otherwise specified.
Parameter
Forward Voltage
Symbol
V
F
DV
F
/DT
Min
1.48
Typ
2
1.70
1.84
-0.22
-0.18
Max
2.09
Units
V
Conditions
IF = 60 mA dc
IF = 100 mA dc
IF = 60 mA dc
IF = 100 mA dc
IF = 100 µA dc
Reference
Figure 9
Forward Voltage Temperature Coefficient
mV/°C
Figure 9
Reverse Input Voltage
Peak Emission Wavelength
Diode Capacitance
Optical Power Temperature Coefficient
V
BR
l
P
C
T
DP
T
/DT
1.8
792
3.8
820
55
-0.006
-0.010
260
0.49
0.31
290
150
865
V
nm
pF
dB/°C
V = 0, f = 1 MHz
I = 60 mA dc
I = 100 mA dc
Notes 3, 8
Thermal Resistance
14x2 Numerical Aperture
14x4 Numerical Aperture
14x2 Optical Port Diameter
14x4 Optical Port Diameter
q
JA
NA
NA
D
D
°C/W
µm
µm
Note 4
Note 4
HFBR-14x2 Output Power Measured Out of 1 Meter of Cable
Parameter
50/125 µm Fiber Cable
NA = 0.2
Symbol
P
T50
Min
-21.8
-22.8
-20.3
-21.9
-19.0
-20.0
-17.5
-19.1
-15.0
16.0
-13.5
-15.1
-10.7
-11.7
-9.2
-10.8
Typ
2
-18.8
-16.8
Max
-16.8
-15.8
-14.4
-13.8
-14.0
-13.0
-11.6
-11.0
-10.0
-9.0
-7.6
-7.0
-4.7
-3.7
-2.3
-1.7
Units
dBm peak
Conditions
T
A
= +25 °C, I
F
= 60mA dc
T
A
= +25 °C, I
F
= 100 mA dc
Reference
Notes 5, 6, 9
62.5/125 µm Fiber Cable
NA = 0.275
P
T62
-16.0
-14.0
dBm peak
T
A
= +25 °C, I
F
= 60mA dc
T
A
= +25 °C, I
F
= 100 mA dc
100/140 µm Fiber Cable
NA = 0.3
P
T100
-12.0
-10.0
dBm peak
T
A
= +25 °C, I
F
= 60mA dc
T
A
= +25 °C, I
F
= 100 mA dc
200 µm HCS Fiber Cable
NA - 0.37
P
T200
-7.1
-5.2
dBm peak
T
A
= +25 °C, I
F
= 60mA dc
T
A
= +25 °C, I
F
= 100 mA dc
CAUTION: The small junction sizes inherent to the design of these components increase the components’ susceptibility to damage
from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of these
components to prevent damage and/or degradation which may be induced by ESD.
16