Package Information
HDMP-0480 Thermal Characteristics,
T
C
= 0°C to +85°C, V
CC
= 3.15V to 3.45V
Symbol
θ
jc
Parameter
Thermal Resistance, Junction to Case
Unit
°C/W
Typ.
10
Max.
—
Note:
Based on independent testing by Agilent.
θ
ja
for these devices is 56°C/W for the HDMP-0480.
θ
ja
is measured on a standard 3x3” FR4 PCB in a still air environment. To determine the actual
junction temperature in a given application, use the following equation: T
j
= T
C
+ (θ
jc
x P
D
), where T
C
is the case temperature measured on the top center of the package, and P
D
is the power being
dissipated.
Item
Package Material
Lead Finish Material
Lead Finish Thickness
Lead Skew
Lead Coplanarity
(Seating Plane Method)
Details
Plastic
85% Tin, 15% Lead
300 – 800 micro-inches
0.08 mm max.
0.08 mm max.
Pin #1 ID
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
1
47
2
46
3
45
4
44
5
43
6
42
7
41
8
40
9
39
10
38
11
37
12
36
13
35
14
34
15
33
16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
10.00
±
0.10
13.20
±
0.25
10.00
±
0.10
13.20
±
0.25
Top View
2.00 + 0.10,
- 0.05
2.45 MAX.
0.17 MAX.
0.25 MIN.
Seating
Plane
0.22
±
0.05
0.50
BASIC
All dimensions shown in mm
0.88
+ 0.15, - 0.10
0.25
Gauge
Plane
Figure 6. HDMP-0480 Package Drawing.
9
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
